| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal ceramic circuit board of excellent heat cycle resistance which is suitable for mounting a large power electronic component such as a power module, and to provide the power module using the board. SOLUTION: An insulating substrate board for a semiconductor comprises a metal alloy layer containing silicon mainly made of aluminum, copper, zinc or nickel formed on at least one surface portion of a ceramic substrate board, and the Vickers hardness of the metal alloy layer is not less than 25 and less than 40. The ceramic substrate board is made of a material selected from a group consisting of alumina, aluminum nitride, and silicon nitride. A semiconductor chip is provided on the other surface of the ceramic substrate board to form the power module. COPYRIGHT: (C)2007,JPO&INPIT |
