| 发明名称 |
SEMICONDUCTOR WAFER, AND MANUFACTURING METHOD FOR SEMICONDUCTOR WAFER |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor wafer with improved edge quality, and manufacturing method for such a semiconductor. <P>SOLUTION: The edge region of the semiconductor wafer is arranged so that it may have no defective portions equal to or greater than 0.3μm. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
| 申请公布号 |
JP2007036231(A) |
申请公布日期 |
2007.02.08 |
| 申请号 |
JP20060198682 |
申请日期 |
2006.07.20 |
| 申请人 |
SILTRONIC AG |
发明人 |
RUPP RUDOLF;AIGNER WERNER;PASSEK FRIEDRICH |
| 分类号 |
H01L21/304;B24B9/00;B24B49/12 |
主分类号 |
H01L21/304 |
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