| 摘要 |
<P>PROBLEM TO BE SOLVED: To eliminate troubles caused by the resistance of contact shoe itself in a device for inspecting an electronic component package. <P>SOLUTION: The device is provided with a plurality of contact shoes 74, 74-1 and 74-2 on which one ends 74a are arranged corresponding to the positions of a plurality of electrode pads arranged on a plane of the electronic components package, a substrate electrode 76 contacted to the other ends74a of the contact shoes 74, 74-1 and 74-2, and secondary contact shoes 80 and 90 electrically connected in the vicinity between the one ends 74a and the other ends 74b of the contact shoes 74-1 and 74-2. <P>COPYRIGHT: (C)2007,JPO&INPIT |
