| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing the occurrence of an edge-short, and realizing both of the miniaturization and the improvement of reliability. <P>SOLUTION: In the semiconductor device 1, a semiconductor chip 3 is mounted on a wiring board 2, and these are sealed with a sealing resin 4. The bonding pad 5 of the wiring board 2 and the electrode 6 of the semiconductor chip 3 are connected using a wire 7 such as an Au-line etc. via a stud bump 9 formed on the bonding pad 5. External connection terminals 8 are formed on the backside (mother board mounting side) of the wiring board 2 via through-holes, wherein conductors are provided through predetermined locations in the wiring board 2. <P>COPYRIGHT: (C)2007,JPO&INPIT |
