| 摘要 |
PROBLEM TO BE SOLVED: To provide packaging/bonding tool and method of a circuit board in which electrostatic breakdown of an electronic component can be prevented even if an adhesive layer is not rendered conductive. SOLUTION: The packaging/bonding tool of a circuit board comprises a carrier 20 stacked on a positioning tool for mounting a flexible printed circuit board 10 and holding the flexible printed circuit board 10 of the positioning tool through an adhesive layer, and a separator 30 placed on the carrier 20 and removing the flexible printed circuit board 10 mounting an electronic component 12 from the carrier 20, and further includes a positioning pin 31 projecting from the separator 30, and a separation pin 32 projecting from the separator 30 and inserted into the carrier 20 in order to remove the flexible printed circuit board 10 held by the adhesive layer of the carrier 20 from the carrier 20. At least any one of the separator 30, the positioning pin 31 and the separation pin 32 is provided with conductivity and earthed thus suppressing electrostatic breakdown of the electronic component 12. COPYRIGHT: (C)2007,JPO&INPIT
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