发明名称 |
SEMICONDUCTOR DEVICE COMPRISING AN INTEGRATED CIRCUIT PROVIDED WITH A CERAMIC SECURITY COATING AND METHOD OF MANUFACTURING SUCH A DEVICE |
摘要 |
<p>A semiconductor device comprising a silicon substrate is provided with semiconductor elements on a first side, a metallization with connection pads for external contact, and a passivation layer which leaves the connection pads of the metallization exposed. The integrated circuit thus formed is also provided with a ceramic security coating having a matrix of monoaluminium phosphate which also leaves the connection pads of the metallization exposed. The protective layer can be deposited so as to have a thickness in the range from 2 to 10 mum, and hence is suitable for protecting integrated circuits used in smart cards. As a result, the information stored therein is not accessible.</p> |
申请公布号 |
EP1029347(B1) |
申请公布日期 |
2007.02.07 |
申请号 |
EP19990921073 |
申请日期 |
1999.06.03 |
申请人 |
KONINKLIJKE PHILIPS ELECTRONICS N.V. |
发明人 |
VERHAEGH, NIJNKE, A., M.;VAN LIEROP, JOSEPH, G.;VAN BOMMEL, MARCUS, J. |
分类号 |
H01L21/56;H01L21/316;H01L23/29;H01L23/31;H01L23/58 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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