| 摘要 |
A hermetic sealing cap member capable of suppressing deterioration of characteristics of an electronic component resulting from a sealant such as solder coming into contact with the electronic component in a package is obtained. This hermetic sealing cap, which is a hermetic sealing cap employed for an electronic component storing package for storing an electronic component ( 5, 34 ), comprises a hermetic sealing cap member ( 11, 41 ), a first plating layer ( 12, 42 ) formed at least on a region other than a region of the hermetic sealing cap member formed with a sealant ( 3, 32 ) and a second plating layer ( 13, 43 ), formed on the region of the hermetic sealing cap member on which the sealant is arranged, containing a material superior in wettability with the sealant to the first plating layer.
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