| 摘要 |
<p>Disclosed is an ampule cutting apparatus including an ampule cutting unit f or housing and cutting an ampule head, a object collecting unit for sucking the cut ampule head and minute flakes generated in the ampule cutting operation with the ai r, and separating the objects from the air, a negative pressure generating device f or applying a negative pressure to the object collecting unit; and a collecting unit for collecting the objects sucked by the object collecting unit.</p> |
