SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

A semiconductor IC device is provided to improve the resistance against a reflow crack by increasing a bonding area between a semiconductor chip and a resin using a through hole of a chip mounting portion. A semiconductor IC device includes a semiconductor chip(2) with a semiconductor IC and bonding pads, a chip mounting portion for mounting the chip, a suspension lead portion(4) for supporting the chip mounting portion, a plurality of inner leads around the chip, a plurality of outer leads prolonged from the inner leads, a plurality of bonding wires for connecting electrically the bonding pads of the chip with front portions of the inner leads, and a resin body for encapsulating selectively the resultant structure. The size of the chip mounting portion is smaller than that of the chip. The chip mounting portion has a through hole(31).