| 摘要 |
A retainer ring and a CMP apparatus with the same are provided to improve the productivity by performing simultaneously a CMP process and a planarizing process using a conditioner plane. A retainer ring(123) comprises a ring type body, a plurality of grooves, and a conditioner plane. The plurality of grooves are formed through the ring type body. The plurality of grooves are spaced apart from each other. The conditioner plane(122) is formed along a periphery of the body to contact a polishing pad. The conditioner plane is formed by plating diamond grains or nickel-containing diamond grains on a predetermined portion between adjacent grooves.
|
