| 发明名称 |
CIRCUIT DEVICE, DISPLAY DEVICE AND ANISOTROPIC CONDUCTIVE FILM |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve a short circuit caused by mounting terminals 2 for a substrate and bumps for an IC chip with a high density by an anisotropic conductive film. <P>SOLUTION: Anisotropic conductive layers 5 are arranged at the places of terminals corresponding to the connecting bumps, and an adhesive film 4 having conductive particles smaller than the anisotropic conductive layers is arranged so as to coat the anisotropic conductive layers 5. Consequently, the substrate and the IC chip are connected by a heating pressure contact-bonding. <P>COPYRIGHT: (C)2007,JPO&INPIT |
| 申请公布号 |
JP2007027483(A) |
申请公布日期 |
2007.02.01 |
| 申请号 |
JP20050208669 |
申请日期 |
2005.07.19 |
| 申请人 |
SEIKO INSTRUMENTS INC |
发明人 |
MATSUDAIRA TSUTOMU;HASEBE MASAO;HAYASHI KEIICHIRO;FUJIOKA YASUHIDE |
| 分类号 |
H01L21/60;G02F1/1345;G09F9/00 |
主分类号 |
H01L21/60 |
| 代理机构 |
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