| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductor pattern forming method forming a conductor pattern by heating at a temperature lower than that in conventional high temperature baking, and also forming the conductor pattern on the surface of a substrate consisting of a heat resistant material. SOLUTION: Because the conductor pattern is formed by using a metal paste having uniformly dispersed metal powder and thermosetting resin therein, when the heating is carried out at a temperature not lower than the thermosetting temperature of the thermosetting resin and not higher than the melting point of the metal powder, the metal paste is set and bonded to the substrate. In the conventional forming method, high temperature baking near the melting point of the metal powder is required, but in the forming method electric conductivity is achieved by bringing the metal powder into mutual contact through the setting and shrinking of the thermosetting resin, so that the conductor pattern is formed by simple heating apparatus at a relatively low temperature and a low heat resistant substrate is used. COPYRIGHT: (C)2007,JPO&INPIT
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