| 摘要 |
PROBLEM TO BE SOLVED: To stably and securely supply a minute amount of solder to a minute soldering land provided on a substrate with large unevenness. SOLUTION: A solder supply method is configured in such a way that upon mounting a minute electronic component 22 being mounted on a substrate 2 a solder is supplied to minute soldering lands 20, 20 on the surface of the substrate 2 on which the minute electronic component 22 is to be mounted. In the method, an elongated capillary 18 is disposed substantially just above the minute soldering lands 20, 20, and from the capillary 18 a solder wire 14 is supplied. A solder ball 14a is melted and formed on the tip end of the solder wire 14 with a torch electrode. Then, the capillary 18 is lowered to join the solder ball 14a to the minute soldering lands 20, 20 for solder supply. COPYRIGHT: (C)2007,JPO&INPIT |
