发明名称 SUBSTRATE DIVIDING METHOD AND SUBSTRATE DIVIDING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate dividing method which divides a scribe-processed substrate surely with a high quality, and a substrate dividing apparatus used therefor. SOLUTION: The substrate dividing apparatus 1 having a base 30, an elastic sheet 20, and a ring 10 is used. In the substrate dividing method, (a) a substrate 70 is stuck to a sheet 20; (b) next, a ring 10 is depressed to stretch the sheet 20 to apply tension force to the substrate 70; (c) then, air is forced into an airtight container 80 comprising the base 30 and the sheet 20 to incurvate the sheet 20 to a convex form so that a bending moment is applied to the substrate 70 to divide it at scribe-processed places; and (d) finally, the curvature of the sheet 20 is relaxed. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007022876(A) 申请公布日期 2007.02.01
申请号 JP20050209555 申请日期 2005.07.20
申请人 SEIKO EPSON CORP 发明人 UMETSU KAZUNARI;KUROKI YASUNOBU
分类号 C03B33/033;B28D5/00;H01L21/301 主分类号 C03B33/033
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