| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface inspection device or a surface inspection method for accurately detecting the height of projection parts formed on a substrate, even when the substrate has a warpages, undulations, or thickness irregularities. SOLUTION: This surface inspection device for inspecting the height of the projection parts, juxtaposed along one direction of a surface of the substrate is provided with a light projection optical system 4 for projecting linear light, extending along the one direction onto the surface of the substrate; a CCD 12 for alternately receiving an on-substrate reflected beam and an on-projection part reflected beam concurrently with its relative movement as to the substrate in the one direction; and a control part 14 for allotting a light-receiving part of the CCD 12 to an ROI<SB>1</SB>and an ROI<SB>2</SB>, and finding the height of the projection parts, based on a distance between each other's peak arising positions of the on-substrate reflected beam received by the ROI<SB>1</SB>and the on-projection part reflected beam received by the ROI<SB>2</SB>. The control part 14 finds the bias direction and bias amount at the peak arising position of either of the reflected beams, and re-allots the ROI<SB>1</SB>and the ROI<SB>2</SB>so as to eliminate the bias. COPYRIGHT: (C)2007,JPO&INPIT
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