| 发明名称 |
Bonding surfaces together via plasma treatment on both surfaces with wet treatment on only one surface |
| 摘要 |
A first surface is bonded to a second surface. The first surface and the second surface are plasma treated. Only the first surface is wet treated. The first surface and the second surface are joined together to bond the first surface to the second surface.
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| 申请公布号 |
US2007023850(A1) |
申请公布日期 |
2007.02.01 |
| 申请号 |
US20050194036 |
申请日期 |
2005.07.30 |
| 申请人 |
CHEN CHIEN-HUA;HALUZAK CHARLES C;FORREST TRACY B |
发明人 |
CHEN CHIEN-HUA;HALUZAK CHARLES C.;FORREST TRACY B. |
| 分类号 |
H01L31/00;H01L21/46 |
主分类号 |
H01L31/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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