SEMICONDUCTOR WAFER THINNING,申请号WO2005FR50959-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	SEMICONDUCTOR WAFER THINNING
摘要	The invention concerns a method for thinning a first semiconductor wafer (1) from a first side (12), which consists in applying, on the second side of the first wafer, a second wafer (3) with an interposed photoresist layer (2).
申请公布号	WO2006054024(A3)	申请公布日期	2007.02.01
申请号	WO2005FR50959	申请日期	2005.11.17
申请人	STMICROELECTRONICS SA;HERNANDEZ, CAROLINE	发明人	HERNANDEZ, CAROLINE
分类号	H01L21/68;H01L21/78	主分类号	H01L21/68
代理机构		代理人
主权项
地址

您可能感兴趣的专利

SURFACE-HYDROPHOBICIZED FILM, MATERIAL FOR FORMATION OF SURFACE-HYDROPHOBICIZED FILM, WIRING LAYER, SEMICONDUCTOR DEVICE AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

Non-Volitile Memory Device For Performing Wear-Leveling and Method Thereof

METHOD OF ENHANCING ENZYME ACTIVITY

CARRIER BOX FOR POLARIZER

FILTER DRYER HAVING FUNCTION OF AUTO-CLAMPING THEREOF

NOISE DETECTION APPARATUS, AND NOISE DETECTION METHOD

CONTROL APPARATUS AND CONTROL METHOD FOR INTERNAL COMBUSTION ENGINE

Multi channel plasma jet generator

APPARATUS AND METHOD FOR GOLF SIMULATION

Ballon insertion appratus for treating urinary incontinence

SYSTEM OF BUILT IN SELF TEST FOR DISCRETE

NONVOLATILE MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME

REPAIRING CIRCUIT AND METHOD OF SEMICONDUCTOR MEMORY APPARATUS

COLUMN COMMAND BUFFER OF SEMICONDUCTOR MEMORY APPARATUS AND LATENCY CIRCUIT INCLUDING THE SAME

SEALING AGENT FOR ROOT BARRIER CONSTRUCTION AND MANUFACTURING METHOD OF THE SAME AND CONSTRUCTION METHOD FOR ROOT BARRIER

THERMO-SENSITIVE DISASSEMBLING APPARATUS AND SPRINKLER HEAD

Membrane Type Cargo Tank For Liquefied Gas, Method of Manufacturing the same and Ship Having the Same

CONTACTLESS TOUCH PANEL