| 摘要 |
A three dimensional measuring apparatus, provided for measuring a position of at least one contact element, applied on a surface of an electronic component, said apparatus comprising a first and a second camera, said first and second camera being each provided with a lens set-up, having an optical axis, said first and second camera being disposed at opposite sides with respect to a perpendicular axis on said surface of said component, in such a manner that their optical axis form each time an angle <>0° with respect to said perpendicular axis, said first and second camera each having an image field, provided for forming thereon a first, respectively a second image pattern of at least one of said contact elements, said first and second camera being connected with an image processor, provided for processing said image patterns formed in said image field by applying a perspective reconstruction on measurements, performed on said first and second image pattern, in order to determine, within a 3D reference frame, said position of said at least one contact element.
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