| 摘要 |
<P>PROBLEM TO BE SOLVED: To increase the electric connection reliability of an electric connection between a semiconductor chip and a circuit board by making the circuit board at the electric connection have an elasticity restoring force. <P>SOLUTION: The semiconductor device comprises an IC chip 1 having bumps 3 formed on electrodes 2, the circuit board 4 whose electrodes 5 are electrically connected to the bumps 3 of the IC chip 1, and a thermosetting resin 6 which is heat-cured between the IC chip 1 and the circuit board 4 to joint them together for them to be electrically connected to each other. The circuit board 4 is joined to the IC chip 1 with elastic deformation remaining in the electrode arrangement region 11, so that it can be restored to the bump 3 side. <P>COPYRIGHT: (C)2007,JPO&INPIT |
