METAL MOLD APPARATUS FOR SEMICONDUCTOR

摘要

A semiconductor molding apparatus is provided to smoothen a cutting process of a punch by completely preventing a scrap from being caught in a guide pin formed in the punch. A material is placed on a die. A stripper(290) is correspondingly disposed on the die. A punch(270) has a guide pin(275) for aligning the material, installed and moved in the stripper. A scrap removing member(300) is disposed near the guide pin so as to remove the scrap caught in the guide pin when the punch is elevated after a cutting process, fixed to the stripper. The scrap removing member surrounds a part or the whole of the outer circumference of the guide pin.