| 摘要 |
When probe-mark inspection is performed using a probe card equipped with a thin film probe, a visual inspection system (51) visually inspects an external view of the major surface of an inspection object, i.e. a wafer, collects inspection results such as adhesion of a dust particle to the major surface of the wafer or abnormal shape of a bump electrode on the major surface of the wafer, as wafer map data in the order of arrangement of respective chips in the wafer plane. The wafer map data is transmitted through a server (52) to a probe inspection system (53) where probe-mark inspection is omitted for the chips which have not passed visual inspection according to the wafer map data and probe-mark inspection is performed for the other chips which have passed visual inspection. ® KIPO & WIPO 2007
|
