| 摘要 |
The invention relates to a method for connecting a flat bridge module; for chip modules to a flat substrate having a flat antenna on its upper side, in order to form a multi-layer transponder, wherein the bridge module has electrically conductive connection surfaces, wherein, in order to form a mechanical connection, an electrically insulating adhesive is arranged as a layer between an underside of the bridge module on the one hand and parts of an upper side of the substrate and parts of an upper side of the antenna on the other hand and then, in order to form an electrical connection, an electrically conductive adhesive is applied to sections of the upper side of the antenna which protrude laterally with respect to the bridge module in such a way that the adhesive at least partially covers the edges of upper sides of the bridge module. A multi-layer transponder is shown. |
