WAFER HOLDING BODY FOR WAFER PROBER AND WAFER PROBER LOADING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a wafer holding body for wafer prober where heat of a chuck top is not transmitted to a driving system as much as possible and position precision of the wafer holding body is improved, and to provide a wafer prober device loading the wafer holding body. SOLUTION: The wafer holding body for wafer prober is for inspecting a semiconductor. The holding body is provided with at least the chuck top and a support body supporting the chuck top. A gap formed between the chuck top and the support body is provided with a cooling mechanism cooling the chuck top and/or the support body. It is desirable that the cooling mechanism has a passage where fluid flows. COPYRIGHT: (C)2007,JPO&INPIT