MANUFACTURE OF ARRAY CHIPS

摘要

The present invention relates to a method of manufacturing an array chip, comprising the steps of: i) depositing at least one ligand onto the active surface of a wafer substrate, having at least one scribe line, the active surface being th reverse of the surface comprising the at least one scribe line; ii) detecting the ligand in relation to the at least one scribe line; and iii) breaking the wafer substrate along the at least one scribe line, to produce at least one array chip.