| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition solution which has good storage stability of the resin, requires a short time of a reduced-pressure drying step, makes a slit nozzle less liable to dry, gives a good film surface, and is suitable for a slit die coater process. <P>SOLUTION: The photosensitive resin composition uses a mixed solvent containing 2-20 wt.% of a compound represented by formula (1) as a solvent, wherein R<SP>1</SP>-R<SP>5</SP>are each independently H or a 1-6C alkyl and n is an integer of 1-6, and the composition is applied on a substrate by a slit die coater. <P>COPYRIGHT: (C)2007,JPO&INPIT |
