发明名称 LGA socket with EMI protection
摘要 A socket is provided which has an insulative housing surrounding a metal substrate. The substrate has an array of apertures which are located in spatially arranged order to accommodate the precise pattern desired for the device to be connected. Contact assemblies include stamped and formed contacts having an insulative plastic molded over a central section of the contact. A grounding clip surrounds the housing and is conductively connected to the substrate, and has spring arms which are connectable to heat sink hardware on one side thereof and to a printed circuit board on the other side.
申请公布号 US7170169(B2) 申请公布日期 2007.01.30
申请号 US20050078957 申请日期 2005.03.11
申请人 TYCO ELECTRONICS CORPORATION 发明人 TROUT DAVID A;WHYNE RICHARD N
分类号 H01L23/48;H01L23/34;H01L23/52;H01L29/40 主分类号 H01L23/48
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