Methods of screening ASIC defects using independent component analysis of quiescent current measurements

摘要

A method and computer program for screening defects in integrated circuit die includes steps of receiving as input measurements of quiescent current for each die in a sample lot of semiconductor die and generating a test matrix from the quiescent current measurements for each die in the sample lot. A de-mixing matrix is computed from independent component analysis that models passing die in the sample lot. A matrix of sources is generated as a product of the test matrix and the de-mixing matrix. The matrix of sources is normalized to zero mean and unit variance. A statistical limit of the passing die in the sample lot is selected from each of the sources in the normalized matrix of sources to determine a maximum and a minimum quiescent current limit for each of the sources. The maximum and the minimum quiescent current limit for each of the sources is generated as output.