发明名称 Conductive paste and ceramic multilayer substrate
摘要 A conductive paste used for forming conductive sinters includes a mixture of a copper powder coated with a metal oxide and a metal oxide powder, and an organic vehicle. The content of the metal oxide used for coating the copper powder is in the range of about 0.05% by weight to about 5% by weight of the total weight of the copper powder coated with the metal oxide and the metal oxide powder, and in addition, the total content of the metal oxide used for coating the copper powder and the metal oxide powder is in the range of about 1% by weight to about 12% by weight of the total weight of the copper powder coated with the metal oxide and the metal oxide powder.
申请公布号 US7169331(B2) 申请公布日期 2007.01.30
申请号 US20040799778 申请日期 2004.03.15
申请人 MURATA MANUFACTURING CO., LTD 发明人 NAKAMURA RYOJI;NISHIDE MITSUYOSHI
分类号 H01B1/22;B32B18/00;H01B1/16;H01G4/12;H05K1/09;H05K3/46 主分类号 H01B1/22
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