| 摘要 |
An interface enhancing apparatus is provided for increasing the potential number of interfaces on the interface panel of a modular platform board. The interface enhancing apparatus may include a first component coupled an interface panel of a modular platform board and second component coupled to the first component. The second component may be substantially parallel with the interface panel when the first component is mated with the interface panel, and the second component may have one or more enhanced interfaces configured for electrical communication with the modular platform board.
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