| 摘要 |
A method for fabricating a semiconductor device is provided to more accurately inspect a micro pattern bridge between copper patterns, thereby increasing the yield of the device. A substrate is subjected to a chemical mechanical polishing process to form a copper pattern. A nitride layer(107) is deposited on the copper pattern to have a thickness of 100 angstrom or more, and a photosensitive film is applied on the nitride layer to form a photosensitive film pattern. The photosensitive film pattern is selectively etched and removed by using the photosensitive film pattern as a mask. Then, the photosensitive film pattern is removed, and the exposed copper pattern is inspected.
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