发明名称 FILM DEPOSITING METHOD, FILM FORMING METHOD, METHOD OF FORMING FILM DEPOSITING DEVICE, FILM FORMING DEVICE, ELECTRO-OPTICAL DEVICE MANUFACTURING METHOD, ELECTRO-OPTICAL DEVICE, AND ELECTRONIC APPRATUS
摘要 PROBLEM TO BE SOLVED: To provide a film forming method which is capable of forming a film excellent in cracking resistant properties. SOLUTION: The film forming method comprises processes of inserting a substrate into a furnace kept at a prescribed temperature, heating the inside of the furnace, depositing a film on the substrate inside the furnace, and cooling off the inside of the furnace at a cooling rate slower than a heating rate in a heating process. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007019131(A) 申请公布日期 2007.01.25
申请号 JP20050197079 申请日期 2005.07.06
申请人 SEIKO EPSON CORP 发明人 YAMAZAKI RYOSUKE
分类号 H01L21/316;G02F1/1368;H01L21/31;H01L29/786 主分类号 H01L21/316
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