| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high frequency package device having good electric characteristics without increasing the size. <P>SOLUTION: The high frequency package device comprises a high frequency package having a bottom wall portion 11, a sidewall portion 13 provided above the bottom wall portion 11 to surround the upper space thereof and a lid 16 sealing the opening of the sidewall portion 13 and forming a cavity 17 above the bottom wall portion 11 together with the sidewall portion 13, a dielectric substrate 18 arranged on the bottom wall portion 11 in the cavity 17, and an input line 15a and an output line 15b penetrating the sidewall portion 13 wherein a protrusion 19 is provided on the cavity 17 side rear surface of the lid 16 in order to shorten the distance to the bottom wall portion 11. <P>COPYRIGHT: (C)2007,JPO&INPIT |
