发明名称 Memory cell and manufacturing methods
摘要 A semiconductor structure and methods of forming the same are provided. The semiconductor structure includes a semiconductor substrate, a first memory device array on the semiconductor substrate, and a logic circuit on the semiconductor substrate. Substantially all gates of at least one type of PMOS and NMOS devices in the first memory device array and the logic circuit are unidirectional. The pocket regions and lightly doped drain/source regions are therefore tilt implanted at rotation angles substantially close to 0 degrees and 180 degrees.
申请公布号 US2007018253(A1) 申请公布日期 2007.01.25
申请号 US20050202445 申请日期 2005.08.12
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 LIAW JHON-JHY
分类号 H01L29/76 主分类号 H01L29/76
代理机构 代理人
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