发明名称 Surface position measuring method, exposure apparatus, and device manufacturing method
摘要 measuring method for measuring a position of the surface of a substrate, wherein measurement light is obliquely projected onto the substrate surface and the measurement light on that surface is detected and wherein, on the basis of a position of the detected measurement light and a predetected offset, the position of the substrate surface with respect to a direction of an optical axis of the projection optical system is measured, the method including: memorizing, as a first position, a position of a measurement point on the substrate while using, as a reference, a reference mark provided on a substrate stage configured to hold and move the substrate; measuring, in accordance with information concerning the memorized first position and in relation to the measurement point, the position of the measurement light as a first measurement position; rotating the substrate by 180 deg. in a plane perpendicular to the optical axis; memorizing, as a second position, a position of the measurement point on the rotated substrate with reference to the reference mark; measuring, in accordance with information concerning the memorized second position and in relation to the measurement point, the position of the measurement light as a second measurement position; and detecting the offset at the measurement point, on the basis of the first measurement position and the second measurement position.
申请公布号 US2007017110(A1) 申请公布日期 2007.01.25
申请号 US20060489896 申请日期 2006.07.20
申请人 OISHI SATORU;INA HIDEKI 发明人 OISHI SATORU;INA HIDEKI
分类号 G01D21/00 主分类号 G01D21/00
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