| 摘要 |
PROBLEM TO BE SOLVED: To provide a deflector for exposing a wafer precisely by reducing the impact of a charged particle beam on the insulating film of a deflector, and to provide a charged particle beam aligner having the deflector and a process for fabricating a device using that charged particle beam aligner. SOLUTION: The deflector of a charged particle beam aligner comprises an opening formed in a substrate and passing a charged particle beam, at least two electrodes arranged oppositely to each other around the opening, and an insulating film interposed between the substrate and the electrode in order to insulate them electrically. Since a potential applied to the electrode is controlled on the basis of the charging potential by a charged particle beam on the insulating film and the charged particle beam is deflected, impact of the charged particle beam on the insulating film of the deflector is reduced and a wafer is exposed precisely. A charged particle beam aligner having that deflector and a process for fabricating a device using that charged particle beam aligner are also provided. COPYRIGHT: (C)2007,JPO&INPIT
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