| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which has such a structure that an element is sealed on a substrate and has a simple structure and is so structured that the sealing hermeticity of the element may be good, and also to provide its manufacturing method. SOLUTION: The semiconductor device comprises the substrate, the element on the substrate, and a sealing structure for sealing the element. The sealing structure includes an organic material portion formed of an organic material. The organic material portion is formed with a protection film formed of an organic material. COPYRIGHT: (C)2007,JPO&INPIT
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