| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device capable of preventing parasitic capacitance while eliminating the necessity of providing a protrusion. SOLUTION: In the semiconductor device, a semiconductor element 2 having a functional surface 2a on its front surface is flipchip-bonded on a substrate 1 having a wiring 5. An adhesive 3 for fixing the semiconductor element 2 to the substrate 1 bonds at least one surface of the surfaces other than the front and rear surfaces of the semiconductor element 2 to the substrate 1, and the adhesive does not enter into a portion between the substrate 1 and the semiconductor element 2. COPYRIGHT: (C)2007,JPO&INPIT
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