| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical module and a hermetically sealing method capable of reduction in cost and size. SOLUTION: An optical module 100 comprises a wiring board 10 having a first substrate 11 and a wiring section, a second substrate 29, and an optical element provided in the surface of the above first substrate side of the second substrate. The optical module includes a light chip 20 connected with the above wiring, and a non-transparent wet material 33 provided so as to surround the circumference of the second substrate at least in plane view and also so as to seal an interior space 38 formed between the first substrate and the second substrate. COPYRIGHT: (C)2007,JPO&INPIT
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