| 摘要 |
PROBLEM TO BE SOLVED: To adopt cantilever type probes having a uniform shape respectively, when inspecting an electric characteristic of a chip integrated highly densely on a semiconductor wafer; to separate completely each opening part for inspecting simultaneously a plurality of chips; and to compact the whole body as much as possible without generating mutually physical or electrical interference between probes provided on each opening part. SOLUTION: This probe card for performing electrical measurement in the opposite state to a plurality of chip domains on the semiconductor wafer is equipped with a probe card unit having an opening part corresponding to a prescribed chip domain, a plurality of opening parts provided separately from the opening part as far as a dimension portion equivalent to chip domains to the number of N (N is a positive integer) respectively in the X-axis direction and in the Y-axis direction, and a plurality of cantilever type probes extending from the fringe part of each opening part to the inside; and with a support member for supporting the probe card unit on the tip in the shape extending to the fourth directions. COPYRIGHT: (C)2007,JPO&INPIT
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