SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD OF THE SEMICONDUCTOR COMPONENT

摘要

A semiconductor part and its manufacturing method are provided to embody easily an ultra-small magnetic sensor regardless of the direction of the magnetic sensor and to perform stably a wire bonding process on the magnetic sensor. A semiconductor part includes a semiconductor chip, a plurality of lead terminals(34a to 34d) for contacting electrically the semiconductor chip and a molding portion. The molding portion(40) is used for molding partially the lead terminals and the semiconductor chip. At this time, a predetermined portion of each lead terminal is exposed to the outside through the molding portion. A stepped portion is formed on the molding portion to expose partially the lead terminals to the outside.