| 摘要 |
PURPOSE: An apparatus for fixing a lead frame is provided to uniformly press an inner lead pressuring unit of the lead frame in a wire bonding process, by installing a cylinder unit in a work space of a window clamp. CONSTITUTION: The lead frame(110) is fixed to perform a wire bonding process regarding a semiconductor chip attached to the inner lead of the lead frame and the bonding pad of the lead frame. The lead frame is placed on a heater block(120). Heat is applied to the inner lead of the lead frame in a wire bonding process. A flange is formed at both ends of the window clamp(170). The work space(180) in which a wire bonding process is performed is prepared in the intermediate portion of the window clamp. The cylinder unit(130) pressures the inner lead of the lead frame, installed in the circumferential portion of the work space of the window clamp. A pressuring unit(100) pressures the flange of the window clamp. |
