METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE

摘要

A method of manufacturing an electronic device, particularly an acceleration sensor, comprising providing a wafer ( 10 ) having first and second semiconductor layers ( 12, 16 ) with a buried oxide layer ( 14 ) therebetween and forming a semiconductor device (such as a detection circuit) on one side of the wafer ( 10 ) in the first semiconductor layer ( 16 ) and a micro-electromechanical systems (MEMS) device on the opposite side of the wafer ( 10 ) in the second semi-conductor layer ( 12 ).