| 摘要 |
A soldering device for an automatic soldering machine, which prevents oxidation and erosion of a soldering tank contacted with a solder and a nozzle part for jetting the solder due to the solder, and which is not deformed or damaged in an application atmosphere of a lead-free solder having a high melting point, is provided. A soldering device for an automatic soldering machine comprises: a soldering tank made of titanium to melt and store a solder for soldering a printed circuit board; a first soldering part(120) which has a nozzle plate(124) formed on an upper portion thereof, and is installed within the soldering tank, wherein a plurality of jet holes(122) are formed on the nozzle plate; a second soldering part(130) which has a rectifying plate(134) formed therein, and is installed in rear of the first soldering part, wherein a plurality of through holes(132) are formed in the rectifying plate; an impeller(140) which comprises a plurality of transfer vanes(144) formed between a pair of disks(142), and which is installed at one side of the first and second soldering parts, and is rotated by a drive motor to transfer a solder within the soldering tank toward the first and second soldering parts; and a guide(150) for covering an outer side of the impeller to guide a solder transferred by the impeller to the first and second soldering parts respectively.
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