PACKAGING CHIP COMPRISING INDUCTOR

摘要

A packaging chip having an inductor is provided to reduce a chip size and improve a Q value by implementing an inductor with a sealing material which is used in packaging and is stacked widely on an edge of a substrate. A packaging chip having an inductor includes a substrate(100), a port(120), a sealing unit(130), and a packaging substrate(160). A predetermined circuit element is mounted on the substrate(100). A port(120) is formed on an upper surface of the substrate(100). The sealing unit(130) is electrically connected to an end of the circuit element and the port(120) on the substrate(100). The packaging substrate(160) is contacted with the substrate(100) through the sealing unit(130), and packages the circuit element. The sealing unit(130) is made of a conductive material and has an inductance of a predetermined amplitude. The port(120) includes a signal port and a ground port.