| 发明名称 |
Thermoplastic fluxing underfill composition and method |
| 摘要 |
A flip chip having solder bumps and an underfill that is thermoplastic and fluxing, as well as methods for making such a device. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simplifying flip chip manufacturing processes.
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| 申请公布号 |
US7166491(B2) |
申请公布日期 |
2007.01.23 |
| 申请号 |
US20030458925 |
申请日期 |
2003.06.11 |
| 申请人 |
FRY'S METALS, INC. |
发明人 |
WILSON MARK;GARRETT DAVID |
| 分类号 |
H01L21/44;H01L21/56;H01L23/29 |
主分类号 |
H01L21/44 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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