发明名称 MOTHERBOARD CUTTING METHOD, MOTHERBOARD SCRIBING APPARATUS, PROGRAM AND RECORDING MEDIUM
摘要 <p>A motherboard cutting method includes; (a) a step of forming a scribe line on the motherboard, and (b) a step of breaking the motherboard along the scribe line. The step (a) includes a step of forming a first scribe line for cutting a first unit board from the motherboard and a second scribe line for cutting a second unit board from the motherboard on the motherboard, by shifting press to the motherboard so as to press the motherboard without interruption. Thus, the motherboard cutting method for cutting a plurality of the unit boards from the motherboard is provided. ® KIPO & WIPO 2007</p>
申请公布号 KR20070010173(A) 申请公布日期 2007.01.22
申请号 KR20067023811 申请日期 2005.05.19
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD. 发明人 NISHIO YOSHITAKA
分类号 C03B33/02;B28D5/00;C03B33/023;C03B33/027;C03B33/03;C03B33/033;C03B33/037;C03B33/04;C03B33/07;C03B33/10;G02F1/13;G02F1/1333 主分类号 C03B33/02
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