发明名称 |
MOTHERBOARD CUTTING METHOD, MOTHERBOARD SCRIBING APPARATUS, PROGRAM AND RECORDING MEDIUM |
摘要 |
<p>A motherboard cutting method includes; (a) a step of forming a scribe line on the motherboard, and (b) a step of breaking the motherboard along the scribe line. The step (a) includes a step of forming a first scribe line for cutting a first unit board from the motherboard and a second scribe line for cutting a second unit board from the motherboard on the motherboard, by shifting press to the motherboard so as to press the motherboard without interruption. Thus, the motherboard cutting method for cutting a plurality of the unit boards from the motherboard is provided. ® KIPO & WIPO 2007</p> |
申请公布号 |
KR20070010173(A) |
申请公布日期 |
2007.01.22 |
申请号 |
KR20067023811 |
申请日期 |
2005.05.19 |
申请人 |
MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD. |
发明人 |
NISHIO YOSHITAKA |
分类号 |
C03B33/02;B28D5/00;C03B33/023;C03B33/027;C03B33/03;C03B33/033;C03B33/037;C03B33/04;C03B33/07;C03B33/10;G02F1/13;G02F1/1333 |
主分类号 |
C03B33/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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