发明名称 BONDING APPARATUS
摘要 <p>A wire bonding apparatus 10 including an X table 18 guided to move in the X direction on an XY table base 14 and a driving motor 20 mounted on a motor base 16 with the movable element 22 of the driving motor 20 connected to the X table 18 . The motor main body 24 is guided by a pair of motor guides 26 so as to be movable in the X direction via the laminated bodies 40 . In each laminated body 40 , viscoelastic flat rubber plates that have a spring element and a damping element, and flat rigid plates, are alternately disposed and laminated, so that the rigidity is large in the direction perpendicular to the laminated surfaces, and the rigidity is small in the direction parallel to the laminated surfaces, and the laminated bodies have a recovery force and a damping force due to the viscoelasticity.</p>
申请公布号 KR100672241(B1) 申请公布日期 2007.01.22
申请号 KR20050083974 申请日期 2005.09.09
申请人 发明人
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
主权项
地址
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