发明名称 FIN FET CMOS, METHOD OF MANUFACTURING THE SAME, AND MEMORY DEVICE COMPRISING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a Fin FET CMOS, a method of manufacturing the same, and a memory device comprising the same. <P>SOLUTION: The Fin FET CMOS comprises an n-type transistor provided on a substrate, an interlayer insulating layer stacked on the n-type transistor, and a p-type transistor provided on the interlayer insulating layer. The n-type and p-type transistors have a common gate insulating film and a common fin gate. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007013156(A) 申请公布日期 2007.01.18
申请号 JP20060177271 申请日期 2006.06.27
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 HYUN JAE-WOONG;PARK YOON-DONG;KIM WON-JOO;BYUN SUNG-JAE
分类号 H01L21/8244;H01L21/8238;H01L27/092;H01L27/11;H01L29/41 主分类号 H01L21/8244
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