| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To manufacture a semiconductor device without warping a thin wiring mother substrate. <P>SOLUTION: A manufacturing method for the semiconductor device has a process for sticking a tape 22 on the bottom surface of a reinforcing frame 20 comprising a rectangular frame, a process for sticking on the top surface of the tape 22 a wiring mother substrate 25 having thereon longitudinal and lateral aligning disposals of product forming portions 26 each of which has wirings 3, 4 on its top and bottom surfaces, a process for fastening a semiconductor chip 11 to each product forming portion 26 present on the top surface of the wiring mother substrate 25, a process for connecting by each wire 13 each electrode 12 of the semiconductor chip 11 and the wiring 3, a process for so forming in the reinforcing frame 20 a resin layer 30 made of an insulating resin having a constant thickness as to cover the semiconductor chips 11 and the wires 13, a process for peeling off the tape 22 from the bottom surface of the reinforcing frame 20, a process for forming bump electrodes on the wiring 4 present on the exposed surface of the wiring mother substrate 25, a process for so sticking a tape on the surfaces of the reinforcing frame 20 and the resin layer 30 as to fasten the resin layer 30 to the reinforcing frame 20 with the tape, a process for so cutting the wiring mother substrate 25 and the resin layer 30 longitudinally and laterally by a dicing blade up to a depth ranging to the surface or the medium layer of the tape as to divide them into individual pieces, and a process for so peeling off the tape from the individual pieces as to manufacture a plurality of the semiconductor devices. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
