| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface treatment method of a printed circuit board capable of forming a partial nickel/gold plated state of good quality, in a short process and manufacturing period at a low cost. SOLUTION: The surface treatment method of a printed circuit board includes a process for partially applying a thermo setting or ultraviolet setting type plating resist on the surface layer of a printed wiring board where circuit wiring is formed in a desired shape and covered with a solder resist, a process for curing the plating resist by heating or by radiating an ultraviolet ray, a process for treating the conductor surface of the surface layer of a printed wiring board where no plating resist is covered with nickel/gold plating, and a process for peeling the plating resist. COPYRIGHT: (C)2007,JPO&INPIT
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